Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
 

See us at the following Events

Electrochemical Society Meeting - AiMES 2018 will be held from September 30 – October 4, 2018 in Cancun, Mexico.

Semicon Europa - 13-16 November 2018 - Munich, Germany


AML LAUNCH NEW TOOL - IRIS - IR Wafer Bond Inspection & Maszara Bond Strength tool

If you want a quick & easy way of inspecting your bonded wafers for voids & measure bond strength

Download IRIS Flyer PDF here

 

Recruitment:

AML urgently need; Wafer Process Engineers, Senior Technical, Operations Managers, Engineering Technicians.

See our Careers page for details

AWB Flyer

IRIS Flyer

Wafer Bonder enquiry form

Wafer Bonding Service enquiry form

 

The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ Aligned Wafer Bonding systems, and provides services based around wafer bonding at its state-of-the-art multi-million pound Bondcentre facility situated on the UK’s premiere Science Park in Harwell, Oxfordshire.

AML’s unique Aligned Wafer Bonder systems are the only integrated machines capable of in-situ alignment, activation and bonding on the market.  Read more...

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distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines

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AWB-04,  AWB-08,  NEW "ROCK" Platform and NEW UHV-compatible Bonders

With more than 25 years of experience and expertise, AML is a world leader in the design & manufacture of Wafer Bonding systems offering unique in-situ alignment capabilities.  The AWB-04, AWB-08, and 'ROCK' systems form an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive BONDCENTRE facility provides Wafer Bonding process development, applications and demonstration services to support those with the objective of purchasing a System.  Read more...

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