Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
 

See us at the following Events

Electrochemical Society Meeting - AiMES 2018 will be held from September 30 – October 4, 2018 in Cancun, Mexico.

Semicon Europa - 13-16 November 2018 - Munich, Germany


AML LAUNCH NEW TOOL - IRIS - IR Wafer Bond Inspection & Maszara Bond Strength tool

If you want a quick & easy way of inspecting your bonded wafers for voids & measure bond strength

Download IRIS Flyer PDF here

 

Recruitment:

AML urgently need; Senior Technical, Commercial & General Managers, Equipment Engineers, "Boffins", Engineering Technicians.

See our Careers page for details

AWB Flyer

Wafer Bonder enquiry form

Wafer Bonding Service enquiry form

 

The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ Aligned Wafer Bonding systems, and provides services based around wafer bonding at its state-of-the-art multi-million pound Bondcentre facility situated on the UK’s premiere Science Park in Harwell, Oxfordshire.

AML’s unique Aligned Wafer Bonder systems are the only integrated machines capable of in-situ alignment, activation and bonding on the market.  Read more...

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distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines

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AWB-04,  AWB-08,  NEW "ROCK" Platform and NEW UHV-compatible Bonders

With more than 25 years of experience and expertise, AML is a world leader in the design & manufacture of Wafer Bonding systems offering unique in-situ alignment capabilities.  The AWB-04, AWB-08, and 'ROCK' systems form an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive BONDCENTRE facility provides Wafer Bonding process development, applications and demonstration services to support those with the objective of purchasing a System.  Read more...

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