Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
 



AML's BONDCENTRE provides a wealth of Wafer Bonding experience.

NB Services are only available as a prelude & support to a purchasing a tool:

Wafer Bonding Process Development e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs....
Wafer Bonding process selection & design for your application
Commercial Wafer Bonding Service prototype to low volume production
Wafer Bonding Technology Transfer (inc Equipment) & Training
Associated Processes (Pre & Post Bond)

AML provides a commercial, fast turn round, Wafer Bonding Service for 2", 3", 4", 6" & 8" wafers
Wafers cleaned and bonded in a class 10 clean room environment

Available In-situ Aligned Wafer Bonding Techniques:
Adhesive
Anodic
Direct (High & Low Temperature Unique RADICAL activation)
Eutectic
Glass Fit
Thermo-compression

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New In-situ "i-CAB Chemistry Align & Bond

Applications knowledge for:

MEMS LEDs
Advanced Substrates
3D integration, TSV (Through-Silicon-Vias)
Temporary Bonding
Vacuum Encapsulation
Wafer Level Packaging
Smart Cut - Layer Transfer

For more on our Bondcentre services ring us on +44 (0)1235 833934


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Associated Pre & Post Bond:

Wafer Cleaning & Activation
Wafer Characterisation e.g. Profiling & Surface Roughness
Wafer Structuring: e.g. Channels, Holes & Conducting Vias
Wafer Processing: e.g. Deposition
Inspection of bonded assemblies - SAM & IR

Equipment Set Available:

Wafer Aligner Bonders
Metrology; AFM. Ra, Profile, TTV
Wafer Cleaning
Wafer Activation
Powder Blasting Eg Glass Machining
Inspection: Acoustic Microscope (SAM) & IR
Screen Print - Glass Frit/Adhesive

Also access via long term collaboration with the Rutherford Appleton Laboratory to:
Photolithography
Deposition-PVD & CVD & Furnaces
Etching - Dry & Wet
Wafer Saw
Wire & Bump Bonding
Metrology: Thin Film, Line Width, SEM

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